| Term |
Definition |
| DIMM |
Dual inline memory module, a type of memory often found in first generation DDR main memory for computers. |
| DIP |
Dual inline package, a chip packaging generally designed for ICs and microprocessors. |
| DRAM |
Stands for dynamic random access memory, it is a volatile memory that loses data once power is not connected to it. |
| EEPROM |
Electrically erasable programmable read only memory, often found in electronic devices for storing data or information of small size. This is most often used in test instruments for storing settings or configurations for recall at a later time. |
| FLASH |
A type of non-volatile memory commonly used for storing data from a computer. They are used in many electronic devices such as cellular phones, digital cameras, and even solid state hard drives. |
| FPGA |
Field programmable gate array is a device that allows logic programming with hardware description languages such as VHDL or Verilog. |
| IC |
Integrated circuit. |
| ISP |
In-circuit programming or in-system programming is a type of serial programming that allows you to program a chip while it is already connected in a complete system, as opposed to programming before putting into a system. |
| LCD |
Is the abbreviation for Liquid Crystal Display. |
| NAND |
A logic gate that performs in a way where when two logic signals are 0's, output will be1. If both are 1's, output will be 0. If only one of either is a 1 and other is 0, it will be 1. |
| NOR |
A logic gate where it performs opposite of NAND in a sense that when two logic signals are 1's, output is 0. If they are opposite of each other, output would be 0. If they are both 0's, output is 1. |
| PLCC |
Stands for plastic leaded chip carrier, it is a programming socket type with four sides that has leads ranging from 20 to 84. |
| PLD |
Programmable logic device. |
| QFP |
Quad flat package, often used in chips for NOR flash memory and similar to PLCC packaging. |
| SDRAM |
Synchronous dynamic random access memory, meaning that it responds with a clock signal, as opposed to asynchronous in which it responds to changes as fast as possible. |
| SODIMM |
Small outline dual inline memory module, a common type of memory often found in older laptops with 200-pin connections. They are similar to DIMM, but comes in a smaller size. |
| SOIC |
This packaging, called surface-mounted IC, is a small outline IC that is much smaller than a DIP packaged chip. |
| TQFP |
Thin quad flat pack, a package type in chips with leads ranging from 32 to 176. |
| TSOP |
Thin small-outline package, usually come in two different types. These types of packaging of chips are most often utilized in flash memory ICs. |
| ZIF |
Zero insertion force socket. |
